Semiconductor Device and Method for Forming the Same

ABSTRACT

Methods of forming a semiconductor device include forming an insulation layer on a semiconductor structure, forming an opening in the insulation layer, the opening having a sidewall defined by one side of the insulation layer, forming a first metal layer in the opening, at least partially exposing the sidewall of the opening by performing a wet-etching process on the first metal layer, and selectively forming a second metal layer on the etched first metal layer. An average grain size of the first metal layer is smaller than an average grain size of the second metal layer. Related semiconductor devices are also disclosed.

CROSS-REFERENCE TO RELATED APPLICATION

This U.S. non-provisional patent application is a divisional of U.S.patent application Ser. No. 12/874,865 filed Sep. 2, 2010 which claimspriority under 35 U.S.C. §119 of Korean Patent Application No.10-2009-0083124, filed on Sep. 3, 2009, the disclosure of which ishereby incorporated by reference in its entirety.

BACKGROUND

The present disclosure herein relates to semiconductor devices andmethods of forming the same, and more particularly, to semiconductordevices including a metal pattern and methods of forming the same.

Due to various demands for consumer electronic devices, semiconductordevices embedded therein also need to be more compact and reliable.Accordingly, research continues to be performed that is directed toincreasing the degree of integration and/or performance of semiconductordevices.

Techniques for storing more data in the same physical space may help toachieve a higher degree of integration and/or performance ofsemiconductor devices. To accomplish this, various attempts have beenmade to maintain the original properties of semiconductor devices whilereducing the sizes of components in the semiconductor devices. However,reducing the size of semiconductor components is made more difficult bylimitations in semiconductor device manufacturing equipment.

SUMMARY

The present disclosure relates to semiconductor devices with improvedreliability and methods of forming the same.

Methods of forming a semiconductor device according to some embodimentsinclude forming an insulation layer on a semiconductor structure,forming an opening in the insulation layer, the opening having asidewall defined by one side of the insulation layer, forming a firstmetal layer in the opening, at least partially exposing the sidewall ofthe opening by performing a wet-etching process on the first metallayer, and selectively forming a second metal layer on the etched firstmetal layer. An average grain size of the first metal layer is smallerthan an average grain size of the second metal layer.

The first metal layer and the second metal layer include a gate pattern,and the methods may further include forming an insulation patternbetween the semiconductor structure and the gate pattern.

The methods may further include forming a plurality of openings in theinsulation layer to define a plurality of gate interlayer insulationlayers and forming a plurality of first and second metal layers in therespective plurality of openings to thereby define a plurality of gatepatterns. Forming the gate interlayer insulation layers and theinsulation pattern may include alternately stacking gate interlayerinsulation layers and sacrificial layers on a substrate, forming thehole that penetrates the gate interlayer insulation layers and thesacrificial layers, removing the sacrificial layers, and forming theinsulation pattern conformally in a space, where the sacrificial layersare removed, and the hole.

In still other embodiments, the methods may further include forming abarrier layer between the insulation pattern and the first metal layer,wherein the barrier layer is etched together with the first metal layerduring the wet etching process.

In other embodiments, the insulation pattern may include a compoundbonded by an ionic bond.

In yet other embodiments, the first metal layer and the second metallayer may include the same metal.

In further embodiments, a formation speed of the first metal layer maybe faster than that of the second metal layer.

In still further embodiments, the forming of the first metal layer andthe forming of the second metal layer may include supplying a firstmetal source and a first reducing gas in the opening and supplying asecond metal source and a second reducing gas in the opening,respectively, the first metal source and the second metal source beingformed of the same metal element.

In even further embodiments, the first metal source and the second metalsource may be WF₆.

In yet further embodiments, the first reducing gas and the secondreducing gas may include hydrogen atoms, hydrogen radicals, and/orhydrogen ions.

In yet further embodiments, the first reducing gas may be silane ordiborane and the second reducing gas may be hydrogen gas.

In yet further embodiments, the forming of the insulation pattern andthe opening may include forming an insulation layer on the semiconductorstructure and performing an anisotropic-etching process on theinsulation layer until the top surface of the semiconductor structure isexposed.

In yet further embodiments, the semiconductor structure may furtherinclude a conductive region exposed through the bottom of the openingand the first metal layer is electrically connected to the conductiveregion.

In yet further embodiments, the methods may further include: forming avariable resistance pattern that contacts the second metal layer andforming a third metal layer on the variable resistance pattern.

In other embodiments of the inventive concept, semiconductor devicesinclude a substrate, gate interlayer insulation layers and gatepatterns, which are stacked on the substrate alternately; asemiconductor structure extending upwardly from the substrate alongsidewalls of the gate interlayer insulation layers and the gatepatterns, and an insulation pattern between the gate patterns and thesemiconductor structure, wherein the gate patterns comprise a firstmetal pattern and a second metal pattern, the first metal pattern beingadjacent to the semiconductor structure, the second metal pattern beingspaced apart from the semiconductor structure by the first metalpattern.

In some embodiments, an average grain size of the first metal patternmay be smaller than an average grain size of the second metal pattern.

In other embodiments, the insulation pattern may extend on the top andbottom surfaces of the gate patterns.

In still other embodiments, the second metal pattern may extend on asecond sidewall facing a first sidewall of the gate patterns adjacent tothe semiconductor structure; the second metal pattern protruding morethan the insulation patterns on the second sidewall of the gatepatterns.

In even other embodiments, the semiconductor devices may further includea barrier layer between the first metal pattern and the insulationpattern, where one side of the barrier layer is coplanar with one sideof the first metal pattern.

In yet other embodiments, the insulation pattern may includeOxide-Nitride-Oxide-AluminumOxide (ONOA).

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings are included to provide a furtherunderstanding of the inventive concept, and are incorporated in andconstitute a part of this specification. The drawings illustrateexemplary embodiments of the inventive concept and, together with thedescription, serve to explain principles of the inventive concept. Inthe drawings:

FIG. 1 is a plan view illustrating a semiconductor device according tosome embodiments of the inventive concept;

FIGS. 2A through 2F are manufacturing sectional views taken along theline I-II of FIG. 1 illustrating methods of forming semiconductordevices according to some embodiments of the inventive concept;

FIG. 3 is a sectional view taken along the line I-II of FIG. 1illustrating a semiconductor device according to some embodiments of theinventive concept;

FIGS. 4A and 4B are enlarged views of an area A of FIG. 3;

FIGS. 5A through 5C are manufacturing sectional views illustrating asemiconductor device according to further embodiments of the inventiveconcept;

FIGS. 6 and 7 are views illustrating application examples ofsemiconductor devices according to further embodiments of the inventiveconcept; and

FIGS. 8 and 9 are views illustrating application examples of theembodiments of the inventive concept.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Embodiments of the present invention now will be described more fullyhereinafter with reference to the accompanying drawings, in whichembodiments of the invention are shown. This invention may, however, beembodied in many different forms and should not be construed as limitedto the embodiments set forth herein. Rather, these embodiments areprovided so that this disclosure will be thorough and complete, and willfully convey the scope of the invention to those skilled in the art.Like numbers refer to like elements throughout.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, these elements should notbe limited by these terms. These terms are only used to distinguish oneelement from another. For example, a first element could be termed asecond element, and, similarly, a second element could be termed a firstelement, without departing from the scope of the present invention. Asused herein, the term “and/or” includes any and all combinations of oneor more of the associated listed items.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the invention. Asused herein, the singular forms “a”, “an” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise. It will be further understood that the terms “comprises,”“comprising,” “includes” and/or “including” when used herein, specifythe presence of stated features, integers, steps, operations, elements,and/or components, but do not preclude the presence or addition of oneor more other features, integers, steps, operations, elements,components, and/or groups thereof.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this invention belongs. It will befurther understood that terms used herein should be interpreted ashaving a meaning that is consistent with their meaning in the context ofthis specification and the relevant art and will not be interpreted inan idealized or overly form formal sense unless expressly so definedherein.

It will be understood that when an element such as a layer, region orsubstrate is referred to as being “on” or extending “onto” anotherelement, it can be directly on or extend directly onto the other elementor intervening elements may also be present. In contrast, when anelement is referred to as being “directly on” or extending “directlyonto” another element, there are no intervening elements present. Itwill also be understood that when an element is referred to as being“connected” or “coupled” to another element, it can be directlyconnected or coupled to the other element or intervening elements may bepresent. In contrast, when an element is referred to as being “directlyconnected” or “directly coupled” to another element, there are nointervening elements present.

Relative terms such as “below,” “above,” “upper,” “lower,” “horizontal,”“lateral,” “vertical,” “beneath,” “over,” “on,” etc., may be used hereinto describe a relationship of one element, layer or region to anotherelement, layer or region as illustrated in the figures. It will beunderstood that these terms are intended to encompass differentorientations of the device in addition to the orientation depicted inthe figures.

Embodiments of the invention are described herein with reference tocross-section illustrations that are schematic illustrations ofidealized embodiments (and intermediate structures) of the invention.The thickness of layers and regions in the drawings may be exaggeratedfor clarity. Additionally, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, embodiments of theinvention should not be construed as limited to the particular shapes ofregions illustrated herein but are to include deviations in shapes thatresult, for example, from manufacturing. For example, an implantedregion illustrated as a rectangle will, typically, have rounded orcurved features and/or a gradient of implant concentration at its edgesrather than a discrete change from implanted to non-implanted regions.Likewise, a buried region formed by implantation may result in someimplantation in the region between the buried region and the surfacethrough which the implantation takes place. Thus, the regionsillustrated in the figures are schematic in nature and their shapes arenot intended to illustrate the actual shape of a region of a device andare not intended to limit the scope of the invention.

Referring to FIGS. 1, 2A through 2F, and 3, methods of formingsemiconductor devices according to some embodiments of the inventiveconcept will be described. FIG. 1 is a plan view illustrating asemiconductor device according to some embodiments of the inventiveconcept. FIGS. 2A through 2F and FIG. 3 are manufacturing sectionalviews of a semiconductor device taken along the line I-II of FIG. 1according to some embodiments of the inventive concept.

Referring to FIGS. 1 and 2, a semiconductor substrate 100 (hereinafter,referred to as a substrate) is provided. The semiconductor substrate 100may include a bulk semiconductor, an epitaxial semiconductor layer, asilicon on insulator (SOI) layer or other semiconductor structure. Thesubstrate 100 may include a well region doped with dopants. Aninsulation layer 121 is formed on the substrate 100.

Sacrificial layers SC and gate interlayer insulation layers 123 arealternately stacked on the underlying insulation layer 121. The gateinterlayer insulation layers 123 may be formed of the same material asthe underlying insulation layer 121. The gate interlayer insulationlayers 123 and the sacrificial layers SC may include materials havingrespectively different etch selectivities with respect to an etchsolution. For example, when the gate interlayer insulation layers 123include an oxide, the sacrificial layers SC may include a nitride. Anupper insulation layer 125 may be formed on the uppermost sacrificiallayer SC. The upper insulation layer 125 may include the same insulationmaterial as the gate interlayer insulation layers 123.

The insulation layers 121, 123, and 125 and the sacrificial layers SCare anisotropically etched to form a hole 130 that penetrates theinsulation layers 121, 123, and 125 and the sacrificial layers SC. Thehole 130 penetrates the above layers, and may be formed vertically fromthe plane surface of the substrate 100. In other embodiments, instead ofthe hole 130, a groove that penetrates the insulation layers 121, 123,and 125 and the sacrificial layers SC and extends along a firstdirection of the substrate 100 may be formed.

A semiconductor structure 133 may be formed in the hole 130. Thesemiconductor structure 133 may include a semiconductor element such as,for example, a semiconductor material that includes group IV elements ofthe periodic table, although it will be appreciated that other types ofsemiconductor materials can be used. The semiconductor structure 133 mayinclude a semiconductor element of a single crystal or polycrystallinestate. In particular embodiments, the semiconductor structure 133 mayinclude an active pattern in which a channel region of a transistor isformed.

The semiconductor structure 133 may be a pillar type structure thatfills the hole 130. In other embodiments, the semiconductor structure133 may have a shell form with an inner space. In that case, the innerspace may be filled by an insulation layer. When a groove is formedinstead of the hole 130, a semiconductor layer for filling the groove isformed, and then is patterned, such that the semiconductor structure 133having a pillar form may be formed.

An impurity region 135 may be formed on a top portion of thesemiconductor structure 133. The impurity region 135 may be formed, forexample, by implanting dopants into the top portion of the semiconductorstructure 133. In other embodiments, the impurity region 135 may beformed by performing an in-situ process, such as a diffusion dopingprocess.

Referring to FIG. 2B, an optional groove 140 that penetrates theinsulation layers 121, 123, and 125 and the sacrificial layers SC may beformed by patterning the insulation layers 121, 123, and 125 and thesacrificial layers SC. The groove 140 may extend in a first directionthat is parallel to the top (plane) surface of the substrate 100. Thetop surface of the substrate 100 and the sidewalls of the insulationlayers 121, 123, and 125 and the sacrificial layers SC may be exposed bythe groove 140.

The groove 140 and the hole 130 may have slanted sidewalls. This isbecause the total thickness of layers, which are etched by ananisotropic etching process for forming the groove 140 and the hole 130,is thick. In other embodiments, if the total thickness of the insulationlayers 121, 123, and 125 and the sacrificial layers SC is appropriatelyadjusted, the sidewalls of the groove 140 and the hole 130 may besubstantially vertical to the top surface of the substrate 100.

Referring to FIG. 2C, the sacrificial layers SC are removed. When thesacrificial layers SC include a nitride, they may be removed, forexample, by a wet etching process using H3PO4 solution as an etchingsolution. Openings 150 may be formed between the insulation layers 121,123, and 125 by removing the sacrificial layers SC. Portions of thesidewall of the semiconductor structure 133 may be exposed by theopenings 150. In addition, the top surface of the underlying insulationlayer 121 and the top surfaces and the bottom surfaces of the gateinterlayer insulation layers 123 and the upper insulation layer 125 maybe exposed by the openings 150.

An insulation pattern 142 is formed in the groove 140 and the openings150. The insulation pattern 142 may conformally cover the sidewalls ofthe groove 140 and the openings 150. The insulation pattern 142 may beformed on the sidewall portions of the semiconductor structure 133exposed by the openings 150. The insulation pattern 142 may cover thetop surfaces and bottom surfaces of the gate interlayer insulationlayers 123 and the upper insulation layer 125 and the top surface of theunderlying insulation layer 121. The insulation pattern 142 may beformed on the sidewalls of the insulation layers 121, 123, and 125. Theinsulation pattern 142 on the top surfaces and the bottom surfaces ofthe insulation layers 121, 123, and 125 may define the sidewalls of theopenings 150.

The insulation pattern 142 may include a plurality of insulation layers.In some embodiments, the insulation pattern 142 may include a chargestorage layer. For example, the insulation pattern 142 may include anoxide-nitride-oxide (ONO) layer or an oxide-nitride-oxide-aluminiumoxide(ONOA) layer. In some embodiments, the nitride layer may serve as acharge storage layer in a nonvolatile semiconductor memory device.

A barrier layer 144 may be formed on the insulation pattern 142. Thebarrier layer 144 may be conformally formed on the bottoms and sidewallsof the groove 140 and the openings 150. The barrier layer 144 may beformed to have a thickness of less than about 100 Å. For example, thebarrier layer 144 may be formed to have a thickness of less than about50 Å. The barrier layer 144 may include a metal nitride. For example,the barrier layer 144 may include tungsten nitride (WN) or titaniumnitride (TiN).

Referring to FIG. 2D, a first metal layer 153 may be formed in theopenings 150 and the groove 140. The first metal layer 153 may fill aportion of the groove 140.

Forming the first metal layer 153 may include providing a first metalsource and a first reducing gas in the openings 150 and the groove 140.The first metal source may include a first metal. For example, the firstmetal source may be a compound including a transition metal. The firstreducing gas reduces the metal included in the first metal source. Forexample, the first reducing gas may include a chemical species thatsupplies hydrogen gas, hydrogen radicals, and/or hydrogen ions.

In some embodiments, the first metal source may include WF₆ and thefirst reducing gas may include SiH₄ and/or B₂H₆. When the first metalsource and the first reducing gas are supplied to a reaction chamberinto which the substrate 100 including the structure of FIG. 2C isloaded, a reaction corresponding to a chemical formula 1 below mayoccur.

2WF₆+3SiH₄−>2W+3SiF₄+6H₂  (chemical formula 1)

WF₆ corresponds to the first metal source and SiH₄ corresponds to thefirst reducing gas in the chemical formula 1. The reaction of the firstmetal source and the first reducing gas may be relatively fast.Accordingly, the first metal layer 153 may be deposited with a fastspeed in the openings 150 and the groove 140. As a consequence, thegrain size of the first metal layer 153, which is deposited at a fastspeed, may be relatively small.

Referring to FIG. 2E, a portion of the first metal layer 153 is etchedto form first metal patterns 154 in the openings 150. The first metallayer 153 may be wet-etched. For example, the first metal layer 153 maybe etched by an etching solution including at least one of H₂O₂, H₃PO₄,HNO₃, CH₃COOH, HF, HCl, H₂SO₄, EKC, SF₆, Cl₂, and/or NF₃. One firstmetal pattern 154 is formed in each opening by etching the first metallayer 153. Accordingly, node isolation of the first metal layer 153 mayoccur due to the wet etching. That is, first metal patterns 154 inadjacent openings 150 may be insulated from one another.

Since the first metal layer 153 is etched by the wet etching, etchingbyproducts, which are generated during the etching process of the firstmetal layer 153, may be reduced and/or prevented from polluting thesurface of the insulation pattern 142. In addition, as the first metallayer 153 has a relatively small grain size, etching damage caused bythe wet etching can be reduced. A cleaning process may be additionallyperformed after the wet etching. Dangling bonds on the insulationpattern 142 may be removed by the wet etching process and/or thecleaning process.

During the etching of the first metal layer 153, the barrier layer 144may be etched along with the first metal layer 153 to form a barrierpattern 145. Portions of the insulation pattern 142 that define upperand lower sidewalls of the openings 150 may be exposed by the etching ofthe barrier pattern 145. The etched surface of the barrier pattern 145and the etched surface of the first metal pattern 154 may be coplanar.

The etched surfaces of the first metal pattern 154 and the barrierpattern 145 may be disposed further inside the openings 150 than asurface of the insulation pattern 142 that contacts the sidewalls of thegate interlayer insulation layer 123.

Referring to FIG. 2F, a second metal pattern 156 is formed from theetched surface of the first metal pattern 154. In particular, the secondmetal pattern 156 may be selectively formed from the etched surface ofthe first metal pattern 154. The first metal pattern 154 and the secondmetal pattern 156 formed in one opening may constitute one gate patternLSG, CG, or USG. The gate pattern LSG that is nearest to the substrate100 is a lower selection gate pattern, and the uppermost gate patternUSG among the gate patterns LSG, CG, and USG may be an upper selectiongate pattern. Gate patterns between the lower selection gate LSG and theupper selection gate pattern USG may include memory cell gate patternsCG.

Selectively forming the second metal pattern 156 on the etched surfaceof the first metal pattern 154 may include supplying a second metalsource and supplying a second reducing gas in a reaction chamber.

The second metal source may include a second metal. In some embodiments,the second metal source may include the same metal as the first metalsource. For example, when the second metal source is WF₆ and the secondreducing gas is H₂, reaction occurring in the reaction chamber may bethe following chemical formula 2.

2WF₆+3H₂−>W+6HF  (chemical formula 2)

The chemical reaction corresponding to the chemical formula 2 maypreferentially occur on the etched surface of the first metal pattern154. While not wishing to be bound by a particular theory of operation,the second metal source and the second reducing gas may be absorbed onthe etched surface of the first metal pattern 154. The second reducinggas may be decomposed into an atomic state, and then the decomposedsecond reducing gas of an atomic state reacts to the absorbed secondmetal source, such that the second metal may be deposited on the etchedsurface of the first metal pattern 154.

The reaction for forming the second metal pattern 156 may be relativelyslow. For example, the reaction for forming the second metal pattern 156may progress slower than the reaction for forming the first metal layer153. The second metal pattern 156 may have a lager grain size than thefirst metal pattern 154.

The forming process of the second metal pattern 156 may be performedunder low temperature and low pressure conditions. For example, duringthe forming of the second metal pattern 156, a temperature in thereaction chamber may be below about 500° C. and a pressure in thereaction chamber may be below about 50 Torr. In some embodiments, duringthe forming of the second metal pattern 156, a temperature in thereaction chamber may be about 350° C. and a pressure in the reactionchamber may be about 40 Torr

For starting the deposition of a metal atom, a metal source is providedat a deposition target layer and then accepts electrons from thedeposition target layer. Because the metal source accepts electrons, aportion of atoms attached to the metal of the metal source may beseparated from the metal source. For example, when WF₆ is used as themetal source, it may be separated into WF_(t), and F₆−n (n is an integerless than 6) by electrons provided from the deposition target layer. Theseparated F may be bonded by sharing one atom, constituting the etchingtarget layer, and the provided electron. The bonded one atom and F atomare removed from the deposition target layer in a gas state such thatthe metal is deposited on the deposition target layer.

During the deposition process of the metal atom, one factor that causesthe metal atom to be deposited on the deposition target layer is thatelectrons are provided from the deposition target layer to the metalsource. Accordingly, if the deposition target layer provides electronseasily, the deposition of the metal atom may progress smoothly. Thedegree that the deposition target layer provides electrons may beaffected by the type of chemical bonding in the deposition target layer.The compounds constituting the deposition target layer may be combinedthrough metallic bonds, covalent bonds, and/or ionic bonds. Thecompounds may be bonded by a plurality of bonding factors, but one ofthe plurality of combinations may be predominant. For example, themetallic bond may be predominant during bonding of metal atoms, and thecovalent bond may be predominant during bonding of non-metal atoms. Forconvenience of description, atoms of a particular material areconsidered to be bonded by the most dominant bonding type among thevarious types of atomic bonds. If a compound constituting the depositiontarget layer is bonded by predominantly by ionic bonds, the depositiontarget layer may provide a relatively small amount of electrons to themetal source. In particular, if a compound constituting the depositiontarget layer has strong ionic bonds, the deposition target layer may noteasily provide electrons to the metal source. In contrast, if a compoundconstituting the deposition target layer has strong metallic bonds, thedeposition target layer may easily provide relatively more electrons tothe metal source. Accordingly, if the metal layer is formed by providingthe metal source to the deposition target layer, the formation of themetal layer can be controlled by the types of bonding found in thedeposition target layer.

Accordingly, the deposition of the metal atoms for forming the secondmetal pattern may be performed selectively. The compound constitutingthe insulation pattern 142 may be bonded predominantly by strong ionicbonds. For example, the surface of the insulation pattern 142 exposed bythe openings 150 may include an oxide. A compound including strong ionicbonds may provide less electrons to the second metal source.Accordingly, the second metal source and the second reducing gas may notbe easily absorbed on the insulation pattern 142. In more detail, thereaction for deposition of the second metal layer 156 may includeabsorption of the second metal source and the second reducing gas.Accordingly, since the second metal source and the second reducing gasmay not be easily absorbed on the insulation pattern 142, the secondmetal pattern 156 may not be easily formed on the insulation pattern142.

On the contrary, since the first metal pattern 154 includes compoundsformed predominantly by metallic bonds, the first metal pattern 154 mayprovide relatively more electrons to the second metal source.Accordingly, the second metal source and the second reducing gas may bepreferentially absorbed on the first metal pattern 154. Thus, the secondmetals may be more easily deposited on the first metal pattern 154. Bythe degree difference of metal deposition speed, the second metalpattern 156 may be formed preferentially on the first metal pattern 154.Since the second metal pattern 156 grows selectively, it may not benecessary to perform a node isolation process for isolating the secondmetal patterns 156 in adjacent openings 150. Accordingly, defects of thesecond metal pattern 156, which may occur due to a node isolationprocess, may be avoided. In more detail, the second metal pattern 156may have a relatively large grain size compared to the first metalpattern 154. Accordingly, a node isolation process could cause a largeportion of the second metal pattern to be torn out, which may have a badinfluence on a resistance property of the second metal pattern 156.However, according to embodiments of the inventive concept, the nodeisolation process may be omitted, such that defects of the second metalpattern 156, which would otherwise occur during the node isolationprocess, can be reduced or avoided. In addition, since the second metalpatterns 156 may be electrically separated in the adjacent openings 150,it may be more completely insulated than adjacent gate patterns.

As shown in FIG. 4A, the second metal pattern 156 may grow up to besubstantially even with the sidewall of the insulation pattern 142 onthe sidewalls of the gate interlayer insulation layers 123. In otherembodiments, as shown in FIG. 4B, the second metal pattern 156 mayprotrude beyond the sidewalls of the insulation pattern 142 on thesidewalls of the gate interlayer insulation layers 123. That is, thesecond metal pattern 156 may have overgrowth. Thereby, a resistance ofthe gate pattern including the second metal pattern 156 can be reduced.A resistance of the gate pattern can be adjusted by controlling thedegree of growth of the second metal pattern 156.

Methods of forming the first metal pattern 154 and the second metalpattern 156 according to some embodiments of the inventive concept mayreduce physical defects, such as void and seams, which may otherwiseoccur during the pattern formation process. As mentioned above, sincethe first metal pattern 154 is etched by wet etching, etching byproductsof the first metal pattern 154 (for example, metal atoms in the firstmetal source) that could pollute the insulation pattern 142 may bereduced. For example, etching byproducts that would otherwise becomeattached to the insulation pattern 142 and the second metal pattern 154may be reduced. Since a second metal using the etching byproduct as anucleus grows in a different direction than a second metal that growsfrom the first metal pattern 154, the second metal pattern 154 formedaccording thereto may have physical defects. Moreover, since the etchingbyproducts are formed irregularly on the insulation pattern 142, it maybe difficult to control the second metal pattern 154 growing from theetching byproducts. However, according to some embodiments of theinventive concept, if the second metal pattern 156 is selectively formedfrom the first metal pattern 154, the second metal pattern 156 havingreduced physical defects may be formed. Accordingly, the reliability ofa semiconductor device including the second metal pattern 156 can beimproved.

Referring to FIG. 3, a filling insulation layer 158 is formed to fillthe groove 140. Due to the filling insulation layer 158, the first andsecond metal patterns 154 and 156 stacked sharing the one semiconductorstructure 133 and the first and second metal patterns 154 and 156stacked sharing adjacent another semiconductor structure 133 areseparated. The top surface of the filling insulation layer 158 may beplanarized. When it is planarized, portions of the upper insulationlayer 125 and the insulation pattern 142 on the semiconductor structure133 may be removed together. The planarization may be performed untilthe top surface of the upper insulation layer 125 and the top surface ofthe impurity region 135 in the semiconductor structure 133 are exposed.

An interlayer insulation layer 161 is formed on the semiconductorstructure 133 and the upper insulation layer 125. A bit line contacthole penetrating the interlayer insulation layer 161 is formed. The bitline contact hole may expose the top surface of the impurity region 135.A bit line contact 163 is formed to fill the bit line contact hole. Thebit line contact 163 may include a metal, a doped semiconductor, or ametal compound. A bit line 165 is formed on the interlayer insulationlayer 161 and the bit line contact 163. The bit line 165 may extend in asecond direction intersecting the first direction. The bit line contact163 and the bit line 165 may be formed simultaneously or separately.

Referring to FIGS. 1, 3, 4A, and 4B, a semiconductor device according toan embodiment of the inventive concept will be described. The abovecontents described with reference to FIGS. 1, 2A through 2F, 3, 4A, and4B may be omitted.

Referring to FIGS. 1 and 3, the semiconductor structure 133 is disposedon the substrate 100. The semiconductor structure 133 may have a pillarform that extends upwardly from the substrate 100. The semiconductorstructure 133 may include a single crystal or polycrystallinesemiconductor material. An impurity region 135 may be formed on theuppermost portion of the semiconductor structure 133. The impurityregion 135 may be formed with a higher dopant concentration than otherportions of the semiconductor structure 133.

The insulation layers 121, 123, and 125 may be stacked along thesidewall of the semiconductor structure 133. The insulation layers 121,123, and 125 may include the underlying insulation layer 121 that is themost adjacent to the substrate 100, a plurality of gate interlayerinsulation layers 123 on the underlying insulation layer 121, and theupper insulation layer 125 on the uppermost gate insulation layer 123.The insulation layers 121, 123, and 125 are separated from each otherand may be disposed on the sidewall of the semiconductor structure 133.

An insulation pattern 142 is provided on sidewalls of the semiconductorstructure 133 and the insulation layers 121, 123, and 125. Theinsulation pattern 142 may cover the sidewall of the semiconductorstructure 133 between the insulation layers 121, 123, and 125 and thetop surfaces, bottom surfaces and the sidewalls of the insulation layers121, 123, and 125. The insulation pattern 142 may include a plurality oflayers. The insulation pattern 142 may include an oxide layer, a nitridelayer, or a combination thereof. For example, the insulation pattern 142may be an ONO layer or an ONOA layer.

Openings 150 may be defined between adjacent insulation layers 121, 123,and 125. The openings 150 may be a space that is defined by theinsulation pattern 142 between the adjacent insulation layers 121, 123,and 125. The openings 150 include the bottoms defined by the insulationpattern 142 on the sidewall of the semiconductor structure 133 and thesidewalls defined by the insulation pattern 142 on the top surfaces andbottom surfaces of the insulation layers 121, 123, and 125.

The openings 150 may be filled with a gate pattern. The gate pattern mayinclude a first metal pattern 154 adjacent to the bottom of the openings150 and a second metal pattern 156 on the sidewall of the first metalpattern 154.

Referring to FIG. 4A, one sidewall of the second metal pattern 156 maybe coplanar with the sidewall of the insulation pattern 142 on thesidewalls of the insulation layers 121, 123, and 125 that are notadjacent to the semiconductor structure 133. In other embodiments, asshown in FIG. 4B, one sidewall of the second metal pattern 156 mayprotrude farther laterally than the sidewall of the insulation pattern142 on the sidewalls of the insulation layers 121, 123, and 125. Instill other embodiments, one sidewall of the second metal pattern 156may be disposed within the openings 150. For example, the second metalpattern 156 may be more depressed than the sidewalls of the insulationlayers 121, 123, and 125. The form of the second metal pattern 156 maybe appropriately selected according to an applied device.

The first metal pattern 154 and the second metal pattern 156 may includethe same metal. For example, the first metal pattern 154 and the secondmetal pattern 156 may include tungsten. The first metal pattern 154 mayhave a different grain size than the second metal pattern 156. Forexample, the grain size of the first metal pattern 154 may be smallerthan that of the second metal pattern 156. Thereby, the first metalpattern 154 may have greater resistivity than the second metal pattern156.

The barrier pattern 145 may be provided on the top surface and bottomsurface of the first metal pattern 154. The barrier pattern 145 mayextend between and separate the first metal pattern 154 and thesemiconductor structure 133. The barrier pattern 145 may include atleast one selected from metal compounds including TiN and WN.

One stacked layer structure including the semiconductor structure 133,the gate patterns, the insulation layers 121, 123, and 125, and theinsulation patterns and a different stacked layer structure that issubstantially similar to the one stacked layer structure may be disposedon the substrate 100. The filling insulation layer 158 may be disposedbetween the stacked layer structures. The filling insulation layer 158may contact the insulation pattern 142 on the sidewalls of theinsulation layers 121, 123, and 125 and one sidewall of the second metalpattern 156.

A bit line 165 is provided on the filling insulation layer 158, theupper insulation layer 125, and the semiconductor structure 133. The bitline 165 may be connected to the semiconductor structure 133 by the bitline contact 163. An interlayer insulation layer 161 may be furtherdisposed between the bit line 165, and the upper insulation layer 125and the filling insulation layer 158.

Referring to FIGS. 5A through 5C, a method of forming a semiconductordevice according to further embodiments of the inventive concept will bedescribed.

Referring to FIG. 5A, a semiconductor structure 200 is provided. Thesemiconductor structure 200 may be a semiconductor substrate, anepitaxial semiconductor layer, a silicon on insulator (SOI) layer orother semiconductor structure. The semiconductor structure 200 mayinclude a conductive region and/or an insulating region. An insulationpattern 242 for defining an opening 250 is formed on the semiconductorstructure 200. The insulation pattern 242 may include atoms bonded by anionic bond. The insulation pattern 242 may include an oxide, forexample. The opening 250 may expose the top surface of the semiconductorstructure 200. For example, the opening 250 may expose the top surfaceof the conductive region of the semiconductor structure 200. The opening250 may include the bottom defined by the top surface of thesemiconductor structure 200 and the sidewall defined by the sidewall ofthe insulation pattern 242.

A barrier layer 244 may be formed in the opening 250. The barrier layer244 may be conformally formed on the top surface of the exposedsemiconductor structure 200 (the bottom of the opening 250), thesidewall of the opening 250, and the top surface of the insulationpattern 242. The barrier layer 244 may include a metal compound. Forexample, the barrier layer 244 may include TiN or WN.

A first metal layer 253 may be formed in the opening 250. The forming ofthe first metal layer 253 includes providing a first metal source andproviding a first reducing gas in the reaction chamber. The first metalsource may include a first metal. The first reducing gas may includehydrogen atoms, hydrogen radicals, and/or hydrogen ions. The first metalsource and the first reducing gas may include materials having arelatively fast reaction. For example, the first metal source may be WF6and the first reducing gas may be SiH4 or B2H6. Next, an embodiment thatWF6 is used as the first metal source and SiH4 is used as the firstreducing gas will be described. Reaction between the first metal sourceand the first reducing gas may be expressed with a reaction formula (achemical formula 1 below).

2WF₆+3SiH₄−>2W+3SiF₄+6H₂  (chemical formula 1)

WF₆ corresponds to the first metal source and SiH₄ corresponds to thefirst reducing gas in the chemical formula 1. The reaction of the firstmetal source and the first reducing gas may be relatively fast.Accordingly, the first metal layer 253 may be deposited at a fast speed.Likewise, the grain size of the first metal layer 253, which isdeposited at a fast speed, may be relatively small.

Referring to FIG. 5B, the first metal layer 253 and the barrier layer244 may be wet-etched. The first metal layer 253 and the barrier layer244 may be etched by an etching solution including at least one of H₂O₂,H₃PO₄, HNO₃, CH₃COOH, HF, HCl, H₂SO₄, EKC, SF₆, Cl₂, and NF₃. The firstmetal pattern 254 and the barrier pattern 245 may be formed by the wetetching. The first metal pattern 254 and the barrier pattern 245 mayhave a lower top surface than the insulation pattern 242. The sidewallof the opening 250 may be partially exposed by the wet etching. That is,the sidewall of the insulation pattern 242 may be partially exposed.

Referring to FIG. 5C, the second metal pattern 256 may be selectivelyformed. The second metal pattern 256 may grow anisotropically on thefirst metal pattern 254.

Selectively forming the second metal pattern 256 on the etched surfaceof the first metal pattern 254 may include supplying a second metalsource and supplying a second reducing gas in the reaction chamber.

In an embodiment, the second metal source may include the same metal asthe first metal source. For example, if the second metal source is WF₆and the second reducing is H₂, reaction occurring in the reactionchamber may be the following chemical formula 2.

2WF₆+3H₂−>W+6HF  (chemical formula 2)

The chemical reaction corresponding to the chemical formula 2 may occuron the etched surface of the first metal pattern 254. The second metalsource and the second reducing gas may be absorbed on the etched surfaceof the first metal pattern 254. The second reducing gas is decomposedinto an atomic state, and the decomposed second reducing gas of anatomic state reacts to the second metal source such that the secondmetal may be deposited on the etched surface of the first metal pattern254.

The reaction for forming the second metal pattern 256 may be relativelyslow. For example, the reaction for forming the second metal pattern 256may progress more slowly than the reaction for forming the first metallayer 253.

In these embodiments, in order to slow down the reaction speed of thesecond material source and the second reducing gas, the second metalsource may be provided in greater amounts than the reducing gas. Theforming process of the second metal pattern 256 may be performed underlow temperature and low pressure conditions. For example, during theforming of the second metal pattern 256, a temperature in the reactionchamber may be below about 500° C. and a pressure in the reactionchamber may be below about 50 Torr. In an embodiment, during the formingof the second metal pattern 256, a temperature in the reaction chambermay be about 350° C. and a pressure in the reaction chamber may be about40 Torr.

Referring to FIG. 5C again, a semiconductor device according to furtherembodiments of the inventive concept will be described. The contentsdescribed with reference to FIGS. 5A through 5C will be partiallyomitted.

An insulation pattern 242 may be disposed on the semiconductor structure200. The semiconductor structure 200 may include a conductive regionand/or an insulating region. The insulation pattern 242 may define anopening 250 that exposes at least portion of the conductive region ofthe semiconductor structure 200.

The first metal pattern 254 and the second metal pattern 256 may bedisposed in the opening 250. The first metal pattern 254 is disposed atthe bottom of the opening 250 adjacent to the semiconductor structure200 and the second metal pattern 256 may be disposed on the first metalpattern 254 in the opening 250.

The first metal pattern 254 and the second metal pattern 256 may includethe same metal element. For example, the first metal pattern 254 and thesecond metal pattern 256 may include tungsten. The first metal pattern254 and the second metal pattern 256 may have different average grainsizes. For example, the grain size of the first metal pattern 254 may besmaller than that of the second metal pattern 256. Thereby, the firstmetal pattern 254 may have greater resistivity than the second metalpattern 256.

A barrier pattern 245 may be interposed between the first metal pattern254 and the insulation pattern 242. The top surface of the barrierpattern 245 and the top surface of the first metal pattern 254 may becoplanar.

Referring to FIGS. 6 and 7, application examples of a semiconductordevice according to other embodiments of the inventive concept will bedescribed.

Referring to FIG. 6, a variable resistance layer 263 is disposed on thesecond metal pattern 256 of FIG. 5C. The variable resistance layer 263may include a phase change material, a transition metal oxide, or aplurality of magnetic layers. In this case, the first metal pattern 254and the second metal pattern 256 may serve as a first contact plug.

A top electrode 265 and a bottom electrode 261 may be respectivelydisposed on the top and bottom of the variable resistance layer 263. Thebottom electrode 261 may be interposed between the variable resistancelayer 263 and the second metal pattern 256. The bottom electrode 261 maybe omitted according to a property of the variable resistance layer 263.

Referring to FIG. 7, the first metal pattern 254, the second metalpattern 256, and the barrier pattern 245 of FIG. 5C may electricallycontact the top surfaces of the gate 212 and the impurity region 203constituting a transistor. In this case, the first metal pattern 254 andthe second metal pattern 256 may serve as a contact plug. An ohmic layer216 may be further interposed between the barrier pattern 245 and theimpurity region 203 and/or between the barrier pattern 245 and the gate212.

Referring to FIG. 8, an electronic system 1100 may include a controller1110, an input/output (I/O) 1120, a memory device 1130, an interface1140, and a bus 1150. The controller 1110, the I/O 1120, the memorydevice 1130, and/or the interface 1140 may be electrically connectedthrough the bus 1150. The bus 1150 corresponds to a path through whichdata may be transferred. The controller 1110 may include at least one ofa microprocessor, a digital signal processor, a microcontroller, and/orlogic devices performing equivalent functions thereof. The I/O 1120 mayinclude a keypad, a keyboard, and a display device. The memory device1130 may store data and/or commands. The memory device 1130 may includeat least one of the semiconductor memory devices disclosed in the abovefirst and second embodiments. In addition, the memory device 1130 mayfurther include a semiconductor memory device of a different form (forexample, a flash memory device, a DRAM, and/or SRAM) The interface 1140may perform a function for transmitting data to a communication networkor receiving data from a communication network. The interface 1140 maybe a wire or wireless interface. For example, the interface 1140 mayinclude an antenna or a wire/wireless transceiver. Although notillustrated, the electronic system 1100 may further include a high-speedDRAM and/or SRAM as an operating memory to improve an operation of thecontroller 1110

The electronic system 1100 may be applied to a personal digitalassistant (PDA), a portable computer, a web tablet, a wireless phone, amobile phone, a digital music player, a memory card, or all kinds ofelectronic products for transmitting and/or receiving information via awireless environment.

FIG. 9 is a block diagram illustrating a memory card including asemiconductor memory device according to an embodiment of the inventiveconcept.

Referring to FIG. 9, a memory card 1200 according to an embodiment ofthe inventive concept includes a memory device 1210. The memory device1210 may include at least one of the semiconductor memory devices of thefirst and second embodiments. The memory device 1210 may further includeanother form of a semiconductor memory device (for example, a flashmemory device, a DRAM, and/or SRAM). The memory card 1200 may include amemory controller 1220 for controlling data exchange between a host andthe memory device 1210.

The memory controller 1220 may include a central processing unit (CPU)1222 for controlling general operations of the memory card 1200. Or, thememory controller 1220 may include a SRAM 1221 that serves as anoperating memory of the CPU 1222. Furthermore, the memory controller1220 may further include a host interface (I/F) 1223 and a memory I/F1225. The host I/F 1223 may include a data exchange protocol between thememory card 1200 and a host. The memory I/O 1225 may connect the memorycontroller 1220 with the memory device 1210. Furthermore, the memorycontroller 1220 may further include an error correction circuit (ECC)1224. The ECC 1224 detects and corrects an error of data read from thememory device 1210. Although not illustrated in the drawings, the memorycard 1200 may further include a ROM device for storing code data tointerface with a host. The memory card 1200 may used as a portable datastorage card. Alternatively, the memory card 1200 may be realized with asolid state disk (SSD) that may replace a hard disk of a computersystem.

According to some embodiments of the inventive concept, a first metallayer is formed in an opening and then is wet-etched. A second metalpattern is selectively grown from the wet-etched first metal layer. Ifthe first metal layer is etched by the wet etching, an etching impurityis applied to the sidewall of the opening, such that the second metalpattern is grown preferentially from the first metal layer rather thansidewalls of the opening. Accordingly, metal patterns having reduceddefects may be formed in the opening. Additionally, the second metalpattern is selectively grown such that it is formed being separated froman adjacent second metal pattern. Therefore, two respectively adjacentsecond metal patterns may be formed in a manner that they remaininsulated from each other. Accordingly, a semiconductor device having animproved reliability can be formed.

The above-disclosed subject matter is to be considered illustrative andnot restrictive, and the appended claims are intended to cover all suchmodifications, enhancements, and other embodiments, which fall withinthe true spirit and scope of the inventive concept. Thus, to the maximumextent allowed by law, the scope of the inventive concept is to bedetermined by the broadest permissible interpretation of the followingclaims and their equivalents, and shall not be restricted or limited bythe foregoing detailed description.

What is claimed is:
 1. A method of forming a semiconductor device, themethod comprising: forming an insulation layer on a semiconductorstructure; forming an opening in the insulation layer, the openinghaving a sidewall defined by one side of the insulation layer; forming afirst conductive layer in the opening; at least partially exposing thesidewall of the opening by performing a wet-etching process on the firstconductive layer; and selectively forming a second conductive layer onthe etched first conductive layer, wherein an average grain size of thefirst conductive layer is smaller than an average grain size of thesecond conductive layer.
 2. The method of claim 1, wherein the firstconductive layer and the second conductive layer comprise a gatepattern, the method further comprising forming an insulation patternbetween the semiconductor structure and the gate pattern.
 3. The methodof claim 2, wherein forming the opening comprises forming a plurality ofopenings in the insulation layer to define a plurality of gateinterlayer insulation layers, and forming the gate pattern comprisesforming a plurality of first and second conductive layers in therespective plurality of openings defining a plurality of gate patterns,wherein forming the gate interlayer insulation layers and the insulationpattern comprises: alternately stacking gate interlayer insulationlayers and sacrificial layers on a substrate; forming the hole thatpenetrates the gate interlayer insulation layers and the sacrificiallayers; removing the sacrificial layers; and forming the insulationpattern conformally in a space, where the sacrificial layers areremoved, and in the hole.
 4. The method of claim 2, further comprisingforming a barrier layer between the insulation pattern and the firstconductive layer, wherein the barrier layer is etched together with thefirst conductive layer during the wet etching process.
 5. The method ofclaim 1, wherein the insulation layer comprises a compound bonded by anionic bond.
 6. The method of claim 1, wherein the first conductive layerand the second conductive layer comprise the same metal.
 7. The methodof claim 1, wherein a formation speed of the first conductive layer isfaster than that of the second conductive layer.
 8. The method of claim7, wherein forming the first conductive layer and forming the secondconductive layer comprise supplying a first metal source and a firstreducing gas in the opening and supplying a second metal source and asecond reducing gas in the opening, respectively, the first metal sourceand the second metal source comprising the same metal element.
 9. Themethod of claim 8, wherein the first metal source and the second metalsource comprise WF₆.
 10. The method of claim 8, wherein the firstreducing gas and the second reducing gas comprise hydrogen atoms,hydrogen radicals, and/or hydrogen ions.
 11. The method of claim 8,wherein the first reducing gas comprises silane and/or diborane and thesecond reducing gas comprises hydrogen gas.
 12. The method of claim 1,wherein forming the insulation layer and the opening comprise: forming apreliminary insulation layer on the semiconductor structure; andanisotropically etching the preliminary insulation layer until the topsurface of the semiconductor structure is exposed.
 13. The method ofclaim 12, wherein the semiconductor structure further comprises aconductive region exposed through the bottom of the opening and thefirst conductive layer is electrically connected to the conductiveregion of the semiconductor structure.
 14. The method of claim 12,further comprising: forming a variable resistance pattern that contactsthe second conductive layer; and forming a third conductive layer on thevariable resistance pattern.